
Patrocinado
Upcoming academic positions with the Serra Húnter Programme 2021
Please prepare for the upcoming application period that will be open up on March 15 for the tenure lecturer and April 12 for the associate professor
The Serra Húnter Programme (SHP) is offering 31 positions as tenure-eligible lecturer and 3 as associate professor at the...

hace 53 minutos
| Fecha límite: abr. 04
Portfolio Leader - Coronavirus Drug Discovery Portfolio
The Drug Discovery Unit (DDU) is passionate about tackling unmet medical need for globally important neglected and emerging infectious diseases (including TB, malaria, Chagas disease, coronaviruses), that kill millions of people across the world every year and damage the...

hace 15 horas
R&D Engineer Grinding
Supporting R&D activities on Wafer Grinding and CMP
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...

hace 15 horas
R&D Engineer Layer Transfer
You will be responsible for developing new layer transfer processes and you are participating in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will do
Miniaturization of system...

hace 15 horas
R&D Engineer Die to Wafer bonding
You will be responsible for developing new die bonding processes and will particicpate in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices).
What you will do
Miniaturization of system size is a...

hace 15 horas
R&D engineer Wafer to Wafer bonding
You will be responsible for developing new wafer bonding processes and participate in research activities where wafer to wafer bonding is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will do
Miniaturization of system size is a...

hace 15 horas
R&D Engineer Temporary Wafer Bonding & Debonding
You will be responsible for developing new temporary wafer bonding and debonding processes and you participate in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will...

hace 16 horas
| Fecha límite: mar. 21
PhD student for the automation of high throughput testing facilities
Conducting research for a changing society: This is what drives us at Forschungszentrum Jülich. As a member of the Helmholtz Association, we aim to tackle the grand societal challenges of our time and conduct research into the possibilities of a digitized society, a...